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Reliability of Rohs-Compliant 2D and 3D IC Interconnects

By John Lau | Electronic book text | 0 Review(s)

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This... read more

Format
Electronic book text
Release Date
22 Oct 2010
Author(s)
John H. Lau
Publisher
McGraw-Hill Education
ISBN-13
9780071753807
Pages
560
Format
Electronic book text
Release Date
22 Oct 2010
Author(s)
John H. Lau
Publisher
McGraw-Hill Education
ISBN-13
9780071753807
Pages
560

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